Closed-Form Solution for Thermo-Elastoplastic Strains in Semiconductor Chip Bonding Structures
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چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: JSME international journal. Ser. A, Mechanics and material engineering
سال: 1993
ISSN: 1340-8046
DOI: 10.1299/jsmea1993.36.4_374